Fabrication of optical components using Si, SiGe, SiGeC, and chemical endpoint detection

US6800212B2 · kind B2 · utility

Assignee

• The Regents of the University of California · US

Inventors

• Jeffrey Peterson · Folsom, US
• Charles E. Hunt · Davis, US

Key dates

• Filing date: May 15, 2002
• Grant date: Oct 5, 2004
• Expiry date: Jan 23, 2023

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B2006/1215
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

One embodiment of the present invention provides a system to facilitate using selective etching to form optical components on a circuit device. The system operates by receiving a substrate composed of a first material including a buffer layer composed of a second material. The system forms a sacrificial layer composed of a third material on the buffer layer. Next, the system forms an optical fiber core composed of a fourth material on the sacrificial layer. After the optical fiber core has been formed, the system performs an etching operation using a selective etchant to remove the sacrificial layer. The system also applies a cladding layer to the optical fiber core.