Low peak exotherm curable compositions
US6800671B1 · kind B1 · utility
19Cited by
29References
37Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2000 |
| Grant date | Oct 5, 2004 |
| Priority date | — |
| Expiry date | Apr 21, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2333/14
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
Compositions having a curable unsaturated compound, an adhesion promoter and curing agent which have a peak exotherm of less than 50° C. are disclosed. The compositions when cured are flexible bioadhesives which are also disclosed. Non-curable diluents can be included in the compositions. Flexible bioadhesives formed on biological structures and having low peak exotherms upon curing of curable compositions to form the flexible bioadhesives are disclosed. Compositions having a curable unsaturated compound and a curing agent and a peak exotherm of less than 50° C. are included in the invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.