Multi-chip semiconductor device with specific chip arrangement
US6800945B2 · kind B2 · utility
3Cited by
1References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2002 |
| Grant date | Oct 5, 2004 |
| Priority date | — |
| Expiry date | Jun 3, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a multi-chip-module type semiconductor device, first and second semiconductor elements, a main component of each of the semiconductor elements being semiconductor material to form a semiconductor electric circuit in each of the semiconductor elements, are mounted on and electrically connected to a substrate adapted to be mounted onto a mother board and to be electrically connected to the mother board so that the each of the semiconductor elements is electrically connected to the mother board through the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.