Selective underfill for flip chips and flip-chip assemblies
US6800946B2 · kind B2 · utility
41Cited by
8References
40Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2002 |
| Grant date | Oct 5, 2004 |
| Priority date | — |
| Expiry date | Jan 27, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides a method for attaching a flip chip to a printed wiring board. A bumped opto-electronic or electromechanical flip chip is provided. An underfill material is applied to a first portion of the flip chip, wherein a second portion of the flip chip is free of the underfill material. The flip chip is positioned on a printed wiring board, and a bumped portion of the flip chip is heated to electrically connect the flip chip to the printed wiring board. The second portion of the flip chip remains free of the underfill material when the flip chip is electrically connected to the printed wiring board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.