Patent · US Expired

Housing for accomodating a power semiconductor module and contact element for use in the housing

US6802745B2 · kind B2 · utility

4Cited by

7References

29Claims

0Family size

Assignee

EUPEC Europaeische Gesellschaft fur Leistungshalbleiter mbH · DE

Inventor

Manfred Loddenkoetter · Ibbenbüren, DE

Key dates

Filing date	Nov 18, 2002
Grant date	Oct 12, 2004
Priority date	—
Expiry date	Nov 18, 2022

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A housing device that is used to accomodate at least one power semiconductor module has increased flexibility. Areas of the housing which are configured to receive contact elements in a variety of positions are configured such that the contact elements can be disposed and oriented in a plurality of ways when disposed in each position.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.