Apparatus and method for controlling plating uniformity
US6802950B2 · kind B2 · utility
3Cited by
4References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2002 |
| Grant date | Oct 12, 2004 |
| Priority date | — |
| Expiry date | Nov 26, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/001
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The use of an insulating shield for improving the current distribution in an electrochemical plating bath is disclosed. Numerical analysis is used to evaluate the influence of shield shape and position on plating uniformity. Simulation results are compared to experimental data for nickel deposition from a nickel—sulfamate bath. The shield is shown to improve the average current density at a plating surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.