Semiconductor device and its manufacturing method
US6803324B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2003 |
| Grant date | Oct 12, 2004 |
| Priority date | — |
| Expiry date | Mar 6, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1189
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wiring circuit block is produced by forming a release layer on one of planarized principal surfaces of a mother substrate, forming an insulating layer on the release layer, patterning the insulating layer and forming a wiring layer on the patterned insulating layer, and separating the insulating layer and wiring layer from the release layer on the mother substrate. The circuit block has components, and deposited on the wiring layer, and is mounted on a base circuit board to provide a wiring device. Also, semiconductor chips are mounted on the circuit block, and the circuit block is mounted on a base circuit board to provide a semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.