Circuit board with via through surface mount device contact
US6803527B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2002 |
| Grant date | Oct 12, 2004 |
| Priority date | — |
| Expiry date | Apr 3, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49147
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board apparatus and a method for a circuit board. An embodiment of a circuit board includes a first layer and a second layer; a substrate between the first layer and the second layer; a first surface mount device pad on the first layer of the substrate; a first via, the first via being formed partially or wholly through a first end of the first surface mount device pad, the first via passing through the substrate between the first layer and the second layer; a second surface mount device pad adjacent to the first surface mount device pad; and a second via, the second via being formed partially or wholly through a first end of the second surface mount device pad, the second via passing through the substrate, the first end of the first surface mount device pad being the end of the first surface mount device pad that is the farthest from the first end of the second surface mount device pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.