Integrated circuit packages with interconnects on top and bottom surfaces
US6803648B1 · kind B1 · utility
11Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2003 |
| Grant date | Oct 12, 2004 |
| Priority date | — |
| Expiry date | Mar 7, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor device packages having top and bottom interconnecting surfaces that can be connected to external electrical systems are described. These packages include internal contact leads that are bent such that they extend from a top surface to a bottom surface of the package and thereby form the corresponding interconnecting surfaces. In some embodiments, a solder ball is formed on either the top or bottom portion of the contact leads so that the solder balls form one of the contact surfaces of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.