Flow soldering process and apparatus
US6805282B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 2002 |
| Grant date | Oct 19, 2004 |
| Priority date | — |
| Expiry date | May 24, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/044
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
There is provided a flow soldering process for mounting an electronic component onto a board by a solder material, which process is appropriate for using a lead-free solder material as the solder material.In the flow soldering process, thermal efficiency of flow soldering is improved in preheating step and/or solder material supplying step thereof. In one aspect of the present invention, a heating cover is located above a preheater, and the flow soldering is conducted while the board passes between the heating cover and the preheater. In another aspect of the present invention, a gap between a preheater and a solder bath is 20 to 60 mm. In yet another aspect of the present invention, a distance between a primary wave and a secondary wave is not larger than 60 mm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.