Semiconductor wafer chuck assembly for a semiconductor processing device
US6805338B1 · kind B1 · utility
18Cited by
2References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 13, 2003 |
| Grant date | Oct 19, 2004 |
| Priority date | — |
| Expiry date | Jun 13, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6875
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer chuck assembly for a semiconductor wafer processing device has axially movable wafer support pins associated with a wafer chuck body of the wafer chuck assembly. The wafer support pins are biased to contact and support the backside of a semiconductor wafer when the semiconductor wafer is placed and/or maintained (typically via air suction) on the wafer chuck assembly. Each support pin axially moves independent of one another such that any area of contamination on the backside of the semiconductor wafer that registers with a support pin, moves the affected support pin axially downwardly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.