Patent · US Expired

Vacuum assisted molding apparatus

US6805546B2 · kind B2 · utility

5Cited by
12References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 24, 2001
Grant dateOct 19, 2004
Priority date
Expiry dateJan 11, 2023

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S425/06
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

Vacuum assisted molding apparatus provides reliable sealing about the mold cavity while minimizing the area of the plant floor space occupied by the mold. The apparatus includes an upper die, a lower die, a vacuum source, and a sealing assembly. The upper die includes a generally horizontal molding surface and vertically extending sides. The lower die includes a generally horizontal molding surface cooperating with the upper die to form a mold cavity. The sealing assembly is operable to create a vacuum surrounding the mold cavity.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.