Patent · US Expired

Method for applying hot-melt pressure sensitive adhesives to a backing material

US6805905B2 · kind B2 · utility

3Cited by

5References

7Claims

0Family size

Assignee

BEIERSDORF AG · DE

Inventors

Axel von Wolff · Hamburg, DE
Stefan Godersky · Hamburg, DE
Robert Mayan · Buxtehude, DE
Andreas Kummer · Hamburg, DE

Key dates

Filing date	Jul 26, 2001
Grant date	Oct 19, 2004
Priority date	—
Expiry date	Jul 21, 2022

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC09J2301/204
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A method of partially applying a hot-melt pressure sensitive adhesive composition to a backing material, in whichthe hot-melt pressure sensitive adhesive composition is applied by an applicator to a moving transfer means in such a way that a film formed from the hot-melt adhesive composition comprises voids;the film applied to the transfer means is subsequently applied to a backing material, which is likewise moving.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.