Negative-type photosensitive resin composition
US6806032B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 4, 2003 |
| Grant date | Oct 19, 2004 |
| Priority date | — |
| Expiry date | Apr 9, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/111
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed is a negative-type photosensitive resin composition comprising component (A) that is a product of the Michael addition reaction between an amino group-containing compound (a-1) represented by the general formula (I): (wherein n is an integral number of 1-4), and a polyethyleneglycol di(meth)acrylate (a-2) represented by the general formula (II): (wherein R1 is a hydrogen or a methyl, and m is an integral number of 4-14). The composition of the invention is broadly be applicable in the technical fields of photo masks for etching use in the fabrication of CRT shadow masks, and lead frames for the mounting of IC chips; phosphor patterning of CRT; and further those of photosensitive resin plates, dry films, aqueous photosensitive paints, and aqueous photosensitive adhesives, etc. The composition of the invention has water resistance in spite of its capability of being developed with water and produce effects of enduring acidic wet-etching and repetitive steps of development.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.