Integrated inductive circuits
US6806552B2 · kind B2 · utility
12Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2002 |
| Grant date | Oct 19, 2004 |
| Priority date | — |
| Expiry date | Jul 24, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
Abstract
An integrated inductor may be formed over a substrate. An aperture may be formed by a backside etch through the semiconductor substrate underneath the integrated inductor. The aperture may then be filled with a dielectric material. As a result of the removal of the underlying substrate material, magnetic and capacitive coupling of the inductor to the substrate may be reduced. In addition, in some cases, the presence of the dielectric may facilitate attachment of the resulting die to a leadframe and package without degrading the inductor's performance and may provide better structural support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.