Quadrature hybrid and improved vector modulator in a chip scale package using same
US6806789B2 · kind B2 · utility
79Cited by
12References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2002 |
| Grant date | Oct 19, 2004 |
| Priority date | — |
| Expiry date | Jan 22, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
In accordance with the present invention, a quadrature hybrid circuit is provided comprising a first spiral inductor and a second spiral inductor separated by an insulating layer to provide all necessary capacitances intrinsically. Further, a vector modulator circuit is provided that incorporates a plurality of quadrature hybrid circuits on a MMIC contained within a chip scale package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.