Polished polyimide substrate
US6807328B2 · kind B2 · utility
Inventor
Key dates
| Filing date | May 2, 2003 |
| Grant date | Oct 19, 2004 |
| Priority date | — |
| Expiry date | May 2, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0274
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Polymer substrates, in particular polyimide substrates, and polymer laminates for optical applications are described. Polyimide substrates are polished to an average surface roughness of about 0.25 &mgr;inch, and single-layer or multi-layer waveguide structures are deposited on the polished polyimide substrates. Laminates including polymer or a hybrid organic/inorganic waveguiding film can be deposited on a polished polyimide substrate. The laminate can also include ceramic, piezoelectric and metallic layers. Optical waveguide devices are machined by laser ablation using a combination of IR and UV lasers. A waveguide-fiber coupler with a laser-machined groove for holding the fiber is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.