Systems and methods for removing heat from opto-electronic components
US6807345B2 · kind B2 · utility
5Cited by
4References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 28, 2002 |
| Grant date | Oct 19, 2004 |
| Priority date | — |
| Expiry date | Jan 16, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Systems for removing heat from an opto-electronic component are provided. One such system incorporates an opto-electronic component that is thermally coupled to a heat spreader. The heat spreader is formed, at least partially, of a material capable of propagating optical signals. The heat spreader is operative to receive heat from the opto-electronic component and conduct an amount of the heat through at least a portion of the heat spreader. Methods and other systems also are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.