High throughput plasma treatment system
US6808592B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 9, 2001 |
| Grant date | Oct 26, 2004 |
| Priority date | — |
| Expiry date | May 26, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/139
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for the plasma treatment of parts. The system includes a chamber base sealingly engageable with a reaction chamber to form a treatment chamber and a lifting device operable to lift the reaction chamber from the chamber base. A transfer mechanism is operable to transfer parts along a guide to multiple treatment positions within the treatment chamber when the reaction chamber is disengaged from the chamber base. An electronic control system controls the transfer mechanism for transferring the plurality of parts to the treatment positions. The parts are treated with a plasma produced within the treatment chamber by a plasma-generating device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.