Method of manufacturing a semiconductor device and liquid crystal display
US6808964B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 14, 2003 |
| Grant date | Oct 26, 2004 |
| Priority date | — |
| Expiry date | Feb 14, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/6721
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of manufacturing a semiconductor device including: forming a semiconductor film on a substrate; forming an insulating film on the semiconductor film; forming a conductive film on the insulating film; forming a resist film, which has a sidewall, on the conductive film; forming a gate electrode which has a sidewall inside of the sidewall of the resist film by partially removing the conductive film by etching, using the resist film as a mask; forming a gate insulating film which includes an extended part having a sidewall positioned beyond the sidewall of the gate electrode by partially removing the insulating film by etching, using the resist film as a mask; forming high impurity concentration source and drain regions in regions of the semiconductor film spaced apart from the sidewall of said extended part by injecting impurities into the semiconductor film, using the resist film as a mask; removing the resist film; and forming, after removing the resist film, low impurity concentration regions in the source and drain regions, of which the impurity concentration is relatively lower than that of the high impurity concentration source and drain regions, in regions of the semic…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.