Lead frame and semiconductor device made using the lead frame
US6809409B2 · kind B2 · utility
16Cited by
7References
50Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2002 |
| Grant date | Oct 26, 2004 |
| Priority date | — |
| Expiry date | Dec 20, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame having a body with oppositely facing, substantially planar, first and second surfaces respectively facing in first and second directions and residing in first and second substantially parallel reference planes. The body defines a support for a semiconductor chip and a plurality of leads. The support has a third surface facing in the first direction to which a semiconductor chip can be mounted, and a fourth surface facing in the second direction. At least a part of the fourth surface is spaced from the second reference plane towards the first reference plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.