Patent · US Expired

Electronic module

US6809423B1 · kind B1 · utility

2Cited by

3References

20Claims

0Family size

Assignee

Delphi Technologies · US

Inventors

Pankaj Mithal · Kokomo, US
Bradley R. Knigga · Russiaville, US
Steven A. Middleton · Noblesville, US

Key dates

Filing date	Nov 19, 2003
Grant date	Oct 26, 2004
Priority date	—
Expiry date	Nov 19, 2023

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1433
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic module that includes a plurality of electrically conductive leads, an electrically conductive base plate, a first integrated circuit (IC) die, at least one material block and an electrically non-conductive overmold. The at least one material block functions to more closely match coefficient of thermal expansion (CTE) differences between components of the electronic module.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.