Sealed and pressurized liquid cooling system for microprocessor
US6809928B2 · kind B2 · utility
30Cited by
10References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2002 |
| Grant date | Oct 26, 2004 |
| Priority date | — |
| Expiry date | Mar 27, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
According to some embodiments, a cooling system that may be installed in a computer chassis has a fluid-containing space that is sealed and pressurized by an inert gas. The fluid-containing space may be formed from a cold plate that may serve as a heat sink for an integrated circuit, a heat exchanger, tubing, and a pump volume. A coolant may be contained in the fluid-containing space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.