Heat sink assembly with retaining device
US6809929B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 17, 2003 |
| Grant date | Oct 26, 2004 |
| Priority date | — |
| Expiry date | Jan 17, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink assembly having a retaining device includes a heat sink (30), a retention frame (10), a rectangular fastener (50), four pins (20), and four springs (40). The heat sink includes a base (32) defining four bores (38) therein. The frame is secured to a printed circuit board (60) around an electronic package (70), and defines a pair of through holes (16). A pair of posts (55) depends from opposite sides of the fastener. The pins are received through the bores of the base and in the fastener. The springs surround the pins respectively between the base and the fastener. The posts are deformably extended through the through holes thereby compressing the springs and sandwiching the base between the frame and the springs. The springs cooperatively provide evenly distributed pressing forces on the base. The heat sink is thus easily, firmly and evenly secured to the electronic package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.