Earbud headset
US6810987B1 · kind B1 · utility
73Cited by
10References
27Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 6, 2002 |
| Grant date | Nov 2, 2004 |
| Priority date | — |
| Expiry date | Jan 6, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/107
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An earbud headset is provided that includes a speaker housing which advantageously allows for improved comfort, sound quality, and stability in the ear. The speaker housing includes a head portion and a thin edge portion that extends from the head portion to interface with a faceplate. The thin edge portion allows for acoustic coupling to deeper areas of the user's ear to provide better sound quality. A bias member is operably coupled to the speaker housing to contact an upper concha of the user's ear to provide bias forces for improved stability, sound quality, and universal fit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.