Microelectronic spring with additional protruding member
US6811406B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 12, 2001 |
| Grant date | Nov 2, 2004 |
| Priority date | — |
| Expiry date | Apr 12, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Various structural features for modifying the performance characteristic of cantilevered microelectronic spring structures are disclosed. Generally, the features comprise a protruding member mounted between a supporting substrate and the transverse cantilever beam of a microelectronic spring structure, at a distance spaced apart from the supporting structure from which the beam is cantilevered. The protruding member may be equal to the clearance under the beam, less than the clearance under the beam, or adjustable in height; and may be attached or mounted to either the beam or the substrate. The protruding member may include an adjustable pressure device or an electronic element. The protruding member may induce a reverse wipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.