Methods and apparatus for polishing glass substrates
US6811467B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2003 |
| Grant date | Nov 2, 2004 |
| Priority date | — |
| Expiry date | Jan 23, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B27/0023
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of polishing a surface of a glass, ceramic, or glass-ceramic substrate to minimize the waviness, waviness variation, and average surface roughness of the surface, whereby the substrate is usable for a magnetic or magneto-optical (MO) data/information storage retrieval medium, comprising sequential steps of:(a) performing a primary polishing of the substrate surface in a first polishing apparatus, utilizing a first polishing slurry containing particles of a first abrasive;(b) transferring the substrate to a second polishing apparatus; and(c) performing a final polishing of the substrate surface in the second polishing apparatus, utilizing a second polishing slurry containing particles of a second abrasive, the particles of the second abrasive being smaller than the particles of the first abrasive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.