Inline lapping of magnetic tape
US6811472B2 · kind B2 · utility
1Cited by
20References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2002 |
| Grant date | Nov 2, 2004 |
| Priority date | — |
| Expiry date | Jun 29, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49048
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In one embodiment, the invention is directed toward inline lapping of magnetic tape. The lapping process is performed inline with one or more other magnetic tape manufacturing processes. In this manner, the number of times the magnetic tape is un-spooled and then re-spooled can be reduced. Consequently, the amount of handling of the individual tape pancakes can also be reduced, thus avoiding damage to the edge of the tape, or other damage associated with tape pancake handling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.