Patent · US Expired

Thermosetting composition for electrochemical cell components and methods of making thereof

US6811917B2 · kind B2 · utility

13Cited by
52References
113Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 14, 2001
Grant dateNov 2, 2004
Priority date
Expiry dateAug 21, 2022

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P70/50
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A conductive, moldable composite material for the manufacture of electrochemical cell components comprising a thermosetting resin system and conductive filler wherein the thermosetting resin composition comprises: (1) a polybutadiene or polyisoprene resin; (2) an optional functionalized liquid polybutadiene or polyisoprene resin; (3) an optional butadiene- or isoprene-containing copolymer; and (4) an optional low molecular weight polymer. In a preferred embodiment, the conductive moldable composite material is used to form a bipolar plate, current collector or other electrochemical cell component. Articles made of the conductive moldable composite material are resistant to chemical attack and hydrolysis, have excellent mechanical strength and toughness, have a volume resistivity of about 0.116 ohm-cm or less and preferably about 0.04 ohm-cm or less and a thermal conductivity of at least about 5 watts/meter ° K.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.