Thermoelectric heterostructure assemblies element
US6812395B2 · kind B2 · utility
80Cited by
20References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 6, 2001 |
| Grant date | Nov 2, 2004 |
| Priority date | — |
| Expiry date | Feb 13, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N10/01
Abstract
Improved thermoelectric assemblies are disclosed, wherein layers of heterostructure thermoelectric materials or thin layers of thermoelectric material form thermoelectric elements. The layers are bound together with agents that improve structural strengths, allow electrical current to pass in a preferred direction, and minimize or reduce adverse affects, such a shear stresses, that might occur to the thermoelectric properties and materials of the assembly by their inclusion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.