Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrument
US6812549B2 · kind B2 · utility
118Cited by
4References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2002 |
| Grant date | Nov 2, 2004 |
| Priority date | — |
| Expiry date | Oct 21, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A conductive material is provided to an open end of a penetrating hole penetrating through at least a semiconductor element, on the side of a first surface of the semiconductor element. The conductive material is melted to flow into the penetrating hole. The conductive material is made to flow into the penetrating hole in a state that an atmospheric pressure on the side of a second surface of the semiconductor element opposite to the first surface is lower than an atmospheric pressure on the side of the first surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.