Press-fit chip package
US6812560B2 · kind B2 · utility
8Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2002 |
| Grant date | Nov 2, 2004 |
| Priority date | — |
| Expiry date | Jul 11, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A press-fit integrated chip package is provided comprising a laminate base structure having plated through holes for introducing press-fit elements, and a laminate cover structure providing very fine conducting paths and having a top mounting plane for mounting chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.