Molded eddy current array probe
US6812697B2 · kind B2 · utility
19Cited by
8References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2002 |
| Grant date | Nov 2, 2004 |
| Priority date | — |
| Expiry date | Sep 24, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N27/902
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention provides an eddy current array probe having a complaint body molded around a rigid insert. A flexible eddy current array circuit is wrapped around the outer surface of the compliant body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.