Passive transmission line equalization using circuit-board thru-holes
US6812803B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 5, 2002 |
| Grant date | Nov 2, 2004 |
| Priority date | — |
| Expiry date | Aug 20, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09718
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A high-speed router backplane, and method for its fabrication, are disclosed. The backplane uses differential signaling trace pairs on multiple high-speed signaling layers, the high-speed signaling layers separated by ground planes. Plated signaling thru-holes connect the trace pairs to the board surface for connection to external components. The signaling thru-holes pass through clearances in each ground plane. At selected ground planes, a conductive pad is patterned within each high-speed signaling thru-hole clearance, the pad slightly larger than the thru-hole diameter. The pads affect the impedance characteristics of the thru-holes, thus providing a better impedance match to the differential trace pairs, reducing signal reflections, and improving the ability to signal across the backplane at high speeds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.