Reduced formation of asperities in contact micro-structures
US6813059B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2002 |
| Grant date | Nov 2, 2004 |
| Priority date | — |
| Expiry date | Aug 18, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B26/0808
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A device comprising movable micro-structures configured to contact a substrate is disclosed. The substrate has a metal-insulator-metal construction with an upper metal layer and an insulator being patterned to provide substrate contact regions to a lower metal layer. The micro-structures have metal under layers for providing ribbon contact regions and non-contact regions. In use, a bias voltage is applied across the micro-structures and the top metal layer of the substrate causing the micro-structures and the substrate to contact through the contact regions. During contact, the contact regions are maintained at a potential that is substantially less than the applied bias voltage, thereby reducing the formation of asperities and/or sticking between contacting parts. The micro-structures are preferably ribbon structures in an optical MEM device configured to modulate light.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.