Transducing head having improved studs and bond pads to reduce thermal deformation
US6813118B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2002 |
| Grant date | Nov 2, 2004 |
| Priority date | — |
| Expiry date | Apr 8, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/6005
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A transducing head formed upon a slider has a transducer, an electrical contact layer, a stud electrically connected to the contact layer, and a bond pad electrically connected to the stud. The electrical contact layer is electrically connected to the transducer. The stud is formed of a material having a coefficient of thermal expansion less than about 1.3 times a coefficient of thermal expansion of a slider material forming the slider. The bond pad has a metallic underlayer and a top layer. The metallic underlayer is formed of a material having a coefficient of thermal expansion less than about 1.1 times the coefficient of thermal expansion of the slider material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.