Substrate handling system for aligning and orienting substrates during a transfer operation
US6813543B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2002 |
| Grant date | Nov 2, 2004 |
| Priority date | — |
| Expiry date | Oct 8, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T74/20317
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system is provided for sensing, orienting, and transporting wafers in an automated wafer handling process that reduces the generation of particles and contamination so that the wafer yield is increased. The system includes a robotic arm for moving a wafer from one station to a destination station, and an end-effector connected to an end of the robotic arm for receiving the wafer. The end-effector includes a mechanism for gripping the wafer, a direct drive motor for rotating the wafer gripping mechanism, and at least one sensor for sensing the location and orientation of the wafer. A control processor is provided for calculating the location of the center and the notch of the wafer based on measurements by the sensor(s). Then, the control processor generates an alignment signal for rotating the wafer gripping mechanism so that the wafer is oriented at a predetermined position on the end-effector while the robotic arm is moving to another station.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.