Apparatus and method for cleaning probe card contacts
US6813804B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2002 |
| Grant date | Nov 9, 2004 |
| Priority date | — |
| Expiry date | Jun 6, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R3/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus and method for cleaning debris and residue from a multitude of electrical contacts of a test probe card of an integrated circuit test probe apparatus preferably comprises a silicon wafer having a grooved surface into which the test probe card is moved into pressurized contact. The grooved surface provides a grating structure that when combined with the pressurized electrical contacts will crush any intervening or attached residue particles, which will then break into smaller particles and fall away from the probe card. Pressure and relative movement of the probe card may be controlled by a variety of measurement sensors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.