Frit material and bonding method for microfluidic separation devices
US6814859B2 · kind B2 · utility
62Cited by
42References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2002 |
| Grant date | Nov 9, 2004 |
| Priority date | — |
| Expiry date | Sep 27, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2030/565
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A frit for use in multi-layer microfluidic separation devices is provided. The frit comprises a polymeric membrane that may be securely bonded within the device and minimizes lateral wicking. A secure bond is ensured by treating the polymer to match its surface energy to that of the materials to which it is bound. Treatments include plasma treatment, irradiation and the application of acids.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.