Method for manufacturing a molding tool used for substrate molding
US6814897B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 5, 2000 |
| Grant date | Nov 9, 2004 |
| Priority date | — |
| Expiry date | Apr 20, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S425/81
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to methods for making mold tools. More particularly, the mold tools are used for molding a resin substrate which has fine pits, i.e., concavities and protuberances. The invention also pertains to a method for manufacturing a resin substrate. Such resin substrates may be used as an optical disk, a magnetic disk, a hard disk, etc., for recording data. According to a preferred embodiment of the invention, a first metallic (Ni) mold tool (father) is made which is a duplicate of a master substrate, then a resin mold tool (mother) is made which is a duplicate of the first metallic mold tool and finally a second metallic (Ni) mold tool (son) is made which is a duplicate of the resin mold tool. Both the father and son may be referred to a “stamper”. The invention also relates to methods of manufacturing a mold tool for molding the base of an optical disk having at least one signal recording region and at least one non-signal recording region. The invention also relates to stampers used to make optical disks which have a signal recording region and a non-signal recording region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.