Discontinuous high-modulus fiber metal matrix composite for thermal management applications
US6815084B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2003 |
| Grant date | Nov 9, 2004 |
| Priority date | — |
| Expiry date | Apr 1, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249924
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention includes the use of a high-modulus fiber metal matrix composite material as a backing plate for physical vapor deposition targets, as a lid for microelectronics packages, as a heat spreader, and as a heat sink. In one implementation, copper-coated carbon fibers are mixed with copper powder. In another implementation, the mixture is consolidated to a carbon fiber metal matrix composite by using a vacuum hot press. The resultant backing plate has a coefficient of thermal expansion of 4.9×10−6/C, thermal conductivity of at least 300 W/mK, density of greater than 99% of theoretical, and the composite material of the backing plate is 30% lighter than Cu while also having higher stiffness than Cu. The high-modulus fiber metal matrix composite backing plate can be used for high power W, Ta, and ceramic PVD targets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.