Silicon building blocks in integrated circuit packaging
US6815256B2 · kind B2 · utility
1Cited by
4References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2002 |
| Grant date | Nov 9, 2004 |
| Priority date | — |
| Expiry date | Jan 1, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved silicon building block is disclosed. In an embodiment, the silicon building block has at least two vias through it. The silicon building block is doped and the vias filled with a first material, and, optionally, selected ones of the vias filled instead with a second material. In an alternative embodiment, regions of the silicon building block have metal deposited on them.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.