Hollow airtight semiconductor device package
US6815808B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2001 |
| Grant date | Nov 9, 2004 |
| Priority date | — |
| Expiry date | Sep 26, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention comprises a first main face (22a) on the surface side of a substrate (21a). An island portion (26) is formed on the first main face (22a) and a semiconductor chip (29), etc. are adhered onto the first main face (22a). The semiconductor chip (29), etc. are sealed in a hollow space made by a column portion (23) and a transparent glass plate (36). Then, the column portion (23) and the glass plate (36) are adhered by the light-shielding adhesive resin made of epoxy resin. Accordingly, there can be provided the semiconductor device and a method of manufacturing the same, which can prevent the direct incidence of the light onto the semiconductor chip (29) and the degradation of the characteristic of the semiconductor chip (29) can be suppressed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.