Electrical connection between two faces of a substrate and manufacturing process
US6815827B2 · kind B2 · utility
16Cited by
5References
16Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Aug 26, 2002 |
| Grant date | Nov 9, 2004 |
| Priority date | — |
| Expiry date | Aug 26, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Electrical connection between two faces of a substrate and manufacturing process.The connection is made by a part (46) of a conducting or semi conducting substrate (20) completely surrounded by at least one electrically insulating trench (32, 36, 44). A contact pad (42) is located on the back face (40) and conducting tracks (38) are located on the front face. The connection is made through the substrate itself.Application to the manufacture of circuits, components, sensors, etc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.