Electronic part
US6815834B2 · kind B2 · utility
2Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2003 |
| Grant date | Nov 9, 2004 |
| Priority date | — |
| Expiry date | May 28, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An electronic component includes an electronic element and a substrate to which the electronic element is mounted, the electronic element and the substrate being electrically or mechanically connected to each other by at least three bumps. Both the value obtained by dividing the total bonding-area of the bumps bonded to the electronic element by the mass of the electronic element and the value obtained by dividing the total bonding-area of the bumps bonded to the substrate by the mass of the electronic element are at least about 8.8 mm2/g.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.