Connection/inspection device for semiconductor elements
US6815962B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 13, 2002 |
| Grant date | Nov 9, 2004 |
| Priority date | — |
| Expiry date | Oct 23, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07307
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
There is provided an electric connection-inspection device which does not impair a freedom of selection of using materials from a viewpoint of restriction in terms of product's function with the aptitude of electric features of electric resistance and physical properties of internal stress, and restriction in terms of manufacture as to the appropriation or not of employment of a plating method, and which has a fine construction provided with the excellent durability that an electrode element is hard to adhere and coagulate. An electric connection-inspection device for coming into electrically contact with an object to be inspected to input and output a signal, comprising a plurality of contact terminals, a coating of a second layer having the Young's modulus higher than that of a wiring base-material layer and whose specific resistance is not more than 1×10−4 &OHgr;cm being formed on the surface of the wiring base-material layer positioned at the extreme end of the contact terminal, and a coating of a third layer having a low coagulating property being formed on the surface of the second layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.