Micro-electromechanical devices and methods of manufacture
US6816301B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 6, 2002 |
| Grant date | Nov 9, 2004 |
| Priority date | — |
| Expiry date | Aug 30, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0109
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Micro-eletromechanical devices, substrate assemblies from which the devices can be manufactured, and methods to manufacture the devices are disclosed. The invention combines the advantages of conventional surface and bulk micromachining processes using a sacrificial layer to create an integrated micro-electromechanical system (MIEMS) technology that provides high performance, high yield, and manufacturing tolerance. The devices manufactured according to the present invention include, but are not limited to, pressure sensors, vibration sensors, accelerometers, gas or liquid pumps, flow sensor, resonant devices, and infrared detectors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.