Pluggable electronic module and receptacle with heat sink
US6816376B2 · kind B2 · utility
182Cited by
11References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2003 |
| Grant date | Nov 9, 2004 |
| Priority date | — |
| Expiry date | Jun 3, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/939
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A receptacle assembly includes a guide frame having top, bottom and side walls joined to form an interior cavity configured to receive an electrical module. One of the top, bottom and side walls has an opening therethrough, and a heat sink is mounted over the opening. The heat sink has an engagement surface located proximate the interior cavity of the guide frame, and the engagement surface of the heat sink is configured to physically contact a module when installed in said interior cavity. The heat sink dissipates heat generated in the module and facilitates a data transmission rate of 10 Gbs through the assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.