Stack up assembly
US6816378B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2003 |
| Grant date | Nov 9, 2004 |
| Priority date | — |
| Expiry date | Apr 28, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/066
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.