Photolithographic process for extreme resolution of track width definition of a read head
US6817086B2 · kind B2 · utility
18Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 12, 2002 |
| Grant date | Nov 16, 2004 |
| Priority date | — |
| Expiry date | May 29, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49052
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A bilayer mask employed for lift off has a top strip which bridges between first and second bilayer portions and is completely undercut so that when one or more materials is sputter deposited the materials do not form fences abutting recessed edges of a bottom layer in undercuts below a top layer. Sacrificial protective layers are formed on a sensor and lead layers for protecting these components while overlapping portions of these materials on the top of the sensor formed during deposition can be removed by ion beam sputtering, after which the sacrificial protective layers can be removed by ion milling or reactive ion etching.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.